Samsung’s New Display Driver IC Packaging Solution Enhances Heat Dissipation in High-Performance TV Applications
Samsung’s New Display Driver IC Packaging Solution Enhances Heat Dissipation in High-Performance TV Applications
Samsung Electronics today introduced its latest heat dissipation packaging technology solution for display driver ICs (DDIs) in high-end TV applications. Samsung’s new ultra Low Temperature Chip On Film (u-LTCOF) packaging solution enhances heat dissipation in high-performance, high resolution TVs by minimizing the contact thermal resistance between the DDI package and the display panel chassis.
Read more on PhysOrg
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